A-B 1394C-SJT22-A 驱动器
Feb. 15, 2024 - San Diego, California - congatec–a leading vendor of embedded and edge computing technology–will showcase numerous new Computer-on-Modules at embedded world (Hall 3, Booth 241).
These innovations include new Intel Core Ultra processor-based modules with integrated AI, additionally premieres based on innovative low-power as well as high-performance x86 processor technology will also be featured. The presentations will focus on increased performance, energy efficiency and integrated advanced IIoT- and security functions, which have not been part of any existing Computer-on-Module (COM) offering before now. These will significantly increase the application readiness of COMs and contribute to the particularly efficient and reliable development of modern, multifunctional, and comprehensively connected embedded and IIoT devices and differentiate congatec's offering from alternative procurement options.
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